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forex cross rate

MarketsForex

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Forex Cross Rate

Forex cross rates provide investors with the latest news and introduction of exchange rates, as well as cross exchange rate tables.Investors can know the foreign exchange cross rates between dozens of currencies on the page of "Forex Cross Rate", most of which are the most popular currencies in the world, such as euro, U.S. dollar, Japanese yen, British pound, Swiss franc, Australian dollar, Canadian dollar, and New Zealand dollar. At the same time, investors will also get free access to the latest news and economic calendars of various currencies on the page of "Forex Cross Rate".

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NewsEconomic Calendar

According to TASS news agency: Russian President Vladimir Putin signed a law amending the tax code to support the domestic fuel market.

News Flash04-07 13:30From XTrend Speed
According to TASS news agency: Russian President Vladimir Putin signed a law amending the tax code to support the domestic fuel market.

According to reports from Saudi media Hadass and Al Arabiya Satellite TV, negotiations between the United States and Iran will be held in Pakistan on July 11.

News Flash04-07 13:21From XTrend Speed
According to reports from Saudi media Hadass and Al Arabiya Satellite TV, negotiations between the United States and Iran will be held in Pakistan on July 11.

Ukrainian Energy Company DTEK: Russia attacked a coal mining company in eastern Ukraine, killing one miner and injuring five others.

News Flash04-07 12:53From XTrend Speed
Ukrainian Energy Company DTEK: Russia attacked a coal mining company in eastern Ukraine, killing one miner and injuring five others.

Relevant Egyptian ministers revealed that Egypt is expected to receive 1.5 billion euros in funds under the EU aid package in the next few days.

News Flash04-07 12:10From XTrend Speed
Relevant Egyptian ministers revealed that Egypt is expected to receive 1.5 billion euros in funds under the EU aid package in the next few days.

1. SK Hynix1. Cheongju M15X (key DRAM/HBM production capacity) Estimated shipment pace: gradually contribute to HBM-related supply from 2026; become one of the core sources of AI DRAM increment from 2026 to 2027. 2. Yongin Semiconductor Cluster (Yongin Cluster) Estimated shipment pace: the first Fab enters the production stage in 2027; multiple Fabs continue to expand production from 2028 to 2030; 2030+ full-scale HBM and advanced DRAM base. 3. HBM packaging base in Indiana, USA. Estimated shipment pace: 2027-2028 packaging production capacity will be gradually formed; 2028 will begin to support HBM shipments on a large scale. 2. Samsung Electronics1. Pyeongtaek P4/P5 production line group (core DRAM and HBM) Estimated shipment pace: 2027 partial trial production and customer verification; 2028 large-scale mass production stage. 2. HBM dedicated production capacity expansion (Cheonan/Onyang) Estimated shipment pace: 2027–2028 to enter the HBM4 mass production window. 3. Micron1. Idaho/New York State, USA (Advanced DRAM Base) Estimated shipment pace: Initial wafer output will begin after mid-2027; large-scale supply will begin in 2028+. 2. Singapore's NAND + DRAM hybrid production expansion is expected to ship rhythm: HBM/NAND related production expansion will begin to contribute to output in 2027; it will enter a stable shipping cycle in 2028. Summary: Judging from the production expansion situation, the three production expansions will begin to "gradually materialize" in 2027, but the structural gap is still there. HBM supply will remain a bottleneck. Starting in 2028, a new round of HBM and DRAM production capacity will be released intensively, and the price cycle may enter a rebalancing stage.

News Flash04-07 11:28From XTrend Speed
1. SK Hynix1. Cheongju M15X (key DRAM/HBM production capacity) Estimated shipment pace: gradually contribute to HBM-related supply from 2026; become one of the core sources of AI DRAM increment from 2026 to 2027. 2. Yongin Semiconductor Cluster (Yongin Cluster) Estimated shipment pace: the first Fab enters the production stage in 2027; multiple Fabs continue to expand production from 2028 to 2030; 2030+ full-scale HBM and advanced DRAM base. 3. HBM packaging base in Indiana, USA. Estimated shipment pace: 2027-2028 packaging production capacity will be gradually formed; 2028 will begin to support HBM shipments on a large scale. 2. Samsung Electronics1. Pyeongtaek P4/P5 production line group (core DRAM and HBM) Estimated shipment pace: 2027 partial trial production and customer verification; 2028 large-scale mass production stage. 2. HBM dedicated production capacity expansion (Cheonan/Onyang) Estimated shipment pace: 2027–2028 to enter the HBM4 mass production window. 3. Micron1. Idaho/New York State, USA (Advanced DRAM Base) Estimated shipment pace: Initial wafer output will begin after mid-2027; large-scale supply will begin in 2028+. 2. Singapore's NAND + DRAM hybrid production expansion is expected to ship rhythm: HBM/NAND related production expansion will begin to contribute to output in 2027; it will enter a stable shipping cycle in 2028. Summary: Judging from the production expansion situation, the three production expansions will begin to "gradually materialize" in 2027, but the structural gap is still there. HBM supply will remain a bottleneck. Starting in 2028, a new round of HBM and DRAM production capacity will be released intensively, and the price cycle may enter a rebalancing stage.

German Chancellor Mertz held a phone call with Ukrainian President Volodymyr Zelensky to discuss Russia's air strikes in Kiev and other parts of Ukraine.

News Flash04-07 10:57From XTrend Speed
German Chancellor Mertz held a phone call with Ukrainian President Volodymyr Zelensky to discuss Russia's air strikes in Kiev and other parts of Ukraine.