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MercadosForex

  • Precio
  • Ideas
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  • Gráfico
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  • Mapa de calor
  • Acerca del mercado

MercadosForex

PrecioIdeasSeñalGráficoCruceMapa de calorAcerca del mercado
Forex Mapa de calor

El mapa de calor de Forex en tiempo real muestra el precio del par de divisas en tiempo real y el precio de cierre de la jornada de trading previa, para mostrar la comparación entre las tendencias del mercado de diferentes pares de divisas. XTrend Speed proporciona a sus usuarios un mapa de calor de las divisas en tiempo real. En la página "Mapa de calor" los inversores pueden ver las tasas cambiarias de docenas de divisas, la mayor parte de las cuales son las más populares del mundo, como el euro, el dólar de EEUU, el yen japonés, la libra británica, el franco suizo, el dólar australiano, el dólar canadiense y el dólar de Nueva Zelanda. En la página "Mapa de calor" los inversores pueden comprender en un solo vistazo las subidas y bajadas de un par de divisas, gracias a los diferentes colores y tonos de los colores en la tabla. Al mismo tiempo, en la página "Mapa de calor" los inversores también obtienen acceso gratis a las últimas noticias y a la agenda económica de varias divisas.

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El rendimiento pasado no es indicativo de resultados futuros.

NoticiasAgenda económica

Ukrainian Energy Company DTEK: Russia attacked a coal mining company in eastern Ukraine, killing one miner and injuring five others.

Resumen informativo04-07 12:53De XTrend Speed
Ukrainian Energy Company DTEK: Russia attacked a coal mining company in eastern Ukraine, killing one miner and injuring five others.

Relevant Egyptian ministers revealed that Egypt is expected to receive 1.5 billion euros in funds under the EU aid package in the next few days.

Resumen informativo04-07 12:10De XTrend Speed
Relevant Egyptian ministers revealed that Egypt is expected to receive 1.5 billion euros in funds under the EU aid package in the next few days.

1. SK Hynix1. Cheongju M15X (key DRAM/HBM production capacity) Estimated shipment pace: gradually contribute to HBM-related supply from 2026; become one of the core sources of AI DRAM increment from 2026 to 2027. 2. Yongin Semiconductor Cluster (Yongin Cluster) Estimated shipment pace: the first Fab enters the production stage in 2027; multiple Fabs continue to expand production from 2028 to 2030; 2030+ full-scale HBM and advanced DRAM base. 3. HBM packaging base in Indiana, USA. Estimated shipment pace: 2027-2028 packaging production capacity will be gradually formed; 2028 will begin to support HBM shipments on a large scale. 2. Samsung Electronics1. Pyeongtaek P4/P5 production line group (core DRAM and HBM) Estimated shipment pace: 2027 partial trial production and customer verification; 2028 large-scale mass production stage. 2. HBM dedicated production capacity expansion (Cheonan/Onyang) Estimated shipment pace: 2027–2028 to enter the HBM4 mass production window. 3. Micron1. Idaho/New York State, USA (Advanced DRAM Base) Estimated shipment pace: Initial wafer output will begin after mid-2027; large-scale supply will begin in 2028+. 2. Singapore's NAND + DRAM hybrid production expansion is expected to ship rhythm: HBM/NAND related production expansion will begin to contribute to output in 2027; it will enter a stable shipping cycle in 2028. Summary: Judging from the production expansion situation, the three production expansions will begin to "gradually materialize" in 2027, but the structural gap is still there. HBM supply will remain a bottleneck. Starting in 2028, a new round of HBM and DRAM production capacity will be released intensively, and the price cycle may enter a rebalancing stage.

Resumen informativo04-07 11:28De XTrend Speed
1. SK Hynix1. Cheongju M15X (key DRAM/HBM production capacity) Estimated shipment pace: gradually contribute to HBM-related supply from 2026; become one of the core sources of AI DRAM increment from 2026 to 2027. 2. Yongin Semiconductor Cluster (Yongin Cluster) Estimated shipment pace: the first Fab enters the production stage in 2027; multiple Fabs continue to expand production from 2028 to 2030; 2030+ full-scale HBM and advanced DRAM base. 3. HBM packaging base in Indiana, USA. Estimated shipment pace: 2027-2028 packaging production capacity will be gradually formed; 2028 will begin to support HBM shipments on a large scale. 2. Samsung Electronics1. Pyeongtaek P4/P5 production line group (core DRAM and HBM) Estimated shipment pace: 2027 partial trial production and customer verification; 2028 large-scale mass production stage. 2. HBM dedicated production capacity expansion (Cheonan/Onyang) Estimated shipment pace: 2027–2028 to enter the HBM4 mass production window. 3. Micron1. Idaho/New York State, USA (Advanced DRAM Base) Estimated shipment pace: Initial wafer output will begin after mid-2027; large-scale supply will begin in 2028+. 2. Singapore's NAND + DRAM hybrid production expansion is expected to ship rhythm: HBM/NAND related production expansion will begin to contribute to output in 2027; it will enter a stable shipping cycle in 2028. Summary: Judging from the production expansion situation, the three production expansions will begin to "gradually materialize" in 2027, but the structural gap is still there. HBM supply will remain a bottleneck. Starting in 2028, a new round of HBM and DRAM production capacity will be released intensively, and the price cycle may enter a rebalancing stage.

German Chancellor Mertz held a phone call with Ukrainian President Volodymyr Zelensky to discuss Russia's air strikes in Kiev and other parts of Ukraine.

Resumen informativo04-07 10:57De XTrend Speed
German Chancellor Mertz held a phone call with Ukrainian President Volodymyr Zelensky to discuss Russia's air strikes in Kiev and other parts of Ukraine.

European Commission President Von der Leyen: Ten months ago, the European Commission proposed suspending trade preferential treatment under the EU-Israel Association Agreement.

Resumen informativo04-07 10:13De XTrend Speed
European Commission President Von der Leyen: Ten months ago, the European Commission proposed suspending trade preferential treatment under the EU-Israel Association Agreement.

U.S. Geological Survey: A magnitude 5.1 earthquake occurred 264 kilometers west of Abepura, Indonesia.

Resumen informativo04-07 09:17De XTrend Speed
U.S. Geological Survey: A magnitude 5.1 earthquake occurred 264 kilometers west of Abepura, Indonesia.